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Projects in Design Linked Incentive for Semiconductors Progress

CIO Insider Team | Monday, 5 January, 2026
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The initiatives funded through the government's Design Linked Incentive (DLI) program are experiencing significant growth, with notable achievements including 16 successful tape-outs, the development of 6 ASIC chips, securing 10 patents, involving a workforce of over 1,000 engineers, and leveraging over three times the amount of private investment initially invested.

The goal of the Design Linked Incentive (DLI) Scheme under the Semicon India Program, established by the Ministry of Electronics and Information Technology (MeitY), is to cultivate a self-sufficient and internationally competitive chip design environment.

According to reports, there are a total of 24 chip design projects supported by the Defence Research and Development Organization (DLI) that are focused on critical areas such as video surveillance, drone detection, energy metering, microprocessors, satellite communications, and IoT SoCs.

India is swiftly accelerating its goals in the field of semiconductors, understanding that semiconductor chips play a crucial role in various sectors such as healthcare, transportation, communication, defense, space exploration, and upcoming digital infrastructures.

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The increasing rate of digitalization and automation is leading to a sharp rise in the worldwide demand for semiconductor chips. To address this, the Indian government is bolstering the domestic semiconductor ecosystem and supply chain through initiatives like the Semicon India Program and the India Semiconductor Mission (ISM).

According to reports, there are a total of 24 chip design projects supported by the Defence Research and Development Organization (DLI) that are focused on critical areas such as video surveillance, drone detection, energy metering, microprocessors, satellite communications, and IoT SoCs.

The concentration of semiconductor manufacturing in a few specific regions has created a vulnerability in global supply chains, leaving them susceptible to disruptions. It is imperative to expand the global manufacturing base in order to mitigate risks.

India is increasingly being recognized as a key player in the global semiconductor industry, providing a strategic and reliable option for manufacturers. The Design Linked Incentive (DLI) scheme plays a crucial role in furthering India's goal of establishing a robust fabless capability.

Administered by the Ministry of Electronics and Information Technology (MeitY) as part of the Semicon India Programme, the scheme aims to stimulate a self-sufficient chip design ecosystem through the provision of monetary incentives and access to cutting-edge design infrastructure.

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New businesses and small to medium-sized enterprises (MSMEs) are qualified to receive financial incentives and technical support for developing and implementing semiconductor products. Similarly, other local companies are eligible for financial incentives when deploying semiconductor designs.

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The DLI Scheme provides assistance for semiconductor design throughout all stages of development, encompassing Integrated Circuits (ICs), chipsets, Systems-on-Chip (SoCs), systems, and IP cores. Its objective is to advance the inclusion of domestic semiconductor content and intellectual property in electronic devices, with the goal of decreasing reliance on imports, reinforcing supply chain resilience, and increasing domestic value addition.



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