Intel unveils new Lakefield chipsets for next-gen PCs and devices
Chipset manufacturing giant Intel launched new hybrid processors which have been codenamed Lakefield. Made for next-gen PCs with foldable and dual screen, these chipsets will make the devices of the future
The Intel Core i5 and i3 Lakefield processors with Intel Hybrid Technology will be designed & built for taking powerful workloads and foreground applications and at the same time balancing power and performance optimization for background tasks.
In a statement, Intel said that the new Lakefield chipsets will be fully compatible with 32- and 64-bit Windows applications.
These chipsets could be featured in devices like Samsung Galaxy Book S (coming to select markets this month), followed by the world's first foldable PC, Lenovo ThinkPad X1 Fold, coming later this year with Windows 10.
"Intel Core processors with Intel Hybrid Technology are the touchstone of Intel's vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs," said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms.
Leveraging Intel's 'Foveros 3D' packaging technology, Lakefield processors, as the company claims, are the smallest to deliver Intel Core performance.
Completely compatible with Windows 10 application, the Lakefield chipsets are in up to a 56% smaller package area for up to 47 per cent smaller board size and extended battery life. Thes parameters will enable OEMs a more flexible form factor across single, dual and foldable screen devices.
Intel also claims that Lakefield will be the first Intel Core processors to deliver as low as 0 2.5mW of standby SoC power - a 91% reduction compared to Y-series processors - for more time between charges.
“These new Intel chips will aid real-time communication between the CPU and the OS scheduler to run the right apps on the right cores, delivering up to 1.7 times better graphics performance”, said Intel.