Paras Semiconductors, a division of Paras Defence & Space Technologies, announced that it has formed a technology partnership with BroadPak Corporation, a US-based company, to enhance advanced semiconductor packaging capabilities in India.

The partnership merges Paras's manufacturing goals in optoelectronics, photonics, and co-packaged optics with BroadPak's proficiency in advanced semiconductor packaging and heterogeneous integration.

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Paras Semiconductors seeks to create a cutting-edge heterogeneous integration and 3D packaging OSAT facility in India through this collaboration. The suggested facility will emphasize 2.5D/3D packaging, chiplet integration, hybrid bonding, and fan-out packaging at both wafer and panel levels.

BroadPak Corporation, based in San Jose, California, offers proficiency in advanced packaging design, production, and system integration. Its functionalities encompass the entire packaging development cycle from design to manufacturing.

Through the partnership, Paras Semiconductors will obtain access to BroadPak's cutting-edge design, manufacturing, and integration intellectual property. This encompasses technology transfer and process knowledge in 2.5D/3D packaging and chiplet integration. The collaboration will additionally investigate the co-creation of sophisticated packaging solutions for AI and high-performance computing uses. The initiative also includes cooperative training and skill enhancement for engineers in India.

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The suggested facility will fulfill the demand for large-scale production and strategic electronics, especially semiconductor components for optical and optronic systems. It will additionally support high-performance computing (HPC), networking, and data center applications. The intended functions include wafer-level processing, hybrid bonding, through-silicon vias (TSVs), micro-bumping, and sophisticated interposers. Technologies for redistribution layer (RDL), co-packaged optics, as well as advanced testing and reliability qualification are also incorporated.

Munjal Sharad Shah, MD of Paras Defense & Space Technologies, remarked that entering the semiconductor industry represents a strategic growth opportunity. He mentioned that enhanced packaging abilities enhance current strengths in optics and essential electronics.

Santosh Kumar, CEO of Paras Semiconductors, highlighted the changing industry demands that extend past traditional chip production. He stated that the partnership will aid in enhancing capabilities in 2.5D/3D heterogeneous integration and chiplet designs.

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Farhang Yazdani, CEO and founder of BroadPak Corporation, emphasized the importance of advanced packaging in the innovation of next-generation semiconductors. He stated that India's expanding semiconductor ecosystem offers a significant chance for progress.

The worldwide advanced packaging market is expected to increase from over $40 billion in 2024 to more than $80 billion by 2030, based on estimates from Yole Group. Enhancing these capabilities is a crucial move for India in establishing a complete semiconductor ecosystem.