Samsung, the world's largest memory chip maker, has established a new research laboratory in the United States to focus on the development of next-generation three-dimensional (3D) DRAM.

The new lab operates under Silicon Valley-based Device Solutions America (DSA), which oversees Samsung's U.S. semiconductor manufacturing and will work to develop an upgraded DRAM model that will enable Samsung to lead the global 3D memory chip market.

In October, the South Korean tech giant said it was preparing new 3D structures for sub-10-nanometer DRAMs that enable larger single-chip capacity that can exceed 100 gigabits.

Samsung succeeded in commercializing 3D vertical NAND flash memory chips for the first time in the industry in 2013.

Meanwhile, global semiconductor industry revenue fell 8.8 percent in 2023 due to a slowdown in corporate and consumer spending.

Samsung was affected by the slowdown in the memory market in both the DRAM and NAND segments and recorded a 38 percent year-over-year decline in sales. The memory market was hit primarily by weak demand in the PC, server and smartphone segments, as well as oversupply and excess inventory in the market.

The company is experiencing one of the most challenging times. Over-reliance on its semiconductor chip business almost brought it to its knees in the second quarter of this year. The South Korean firm's memory chip business posted a loss for the first time since its inception. However, it is still the world leader in the production of memory chips.

Artificial intelligence brought positive news for the semiconductor industry, which according to Counterpoint Research proved to be a key driver of content and earnings, especially in the second half of the year.