BE Semiconductor Industries has been receiving takeover inquiries as the demand for its chip-packaging technology has grown more important for semiconductor equipment manufacturers, as per reports.

The chip equipment manufacturer listed in Amsterdam, valued at 14 billion euros ($16.20 billion), has been collaborating with investment bank Morgan Stanley to assess the options, according to reports.

US chip-equipment manufacturer Lam Research is one of the potential buyers that have talked with the Dutch firm, according to one source. Another potentially interested party is equipment manufacturer Applied Materials, which acquired a 9percent share in BESI in April of last year, becoming its largest shareholder.

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The discussions, which began in mid-2025, paused earlier this year due to escalating tensions between the U.S. and European Union regarding U.S. President Donald Trump's efforts to take control of Greenland, according reports. The purchase of a Dutch company with vital technology would undergo a national security assessment. Bidders such as Lam Research continue to show interest in BESI and have engaged in discussions recently.

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BESI, Morgan Stanley, and Applied Materials chose not to comment, whereas Lam Research did not respond right away to a request for comment. In 2024, BESI stated that it was dedicated to implementing its strategy as an independent entity, referencing media reports about a strategic agreement related to the company.

The attention underscores the strategic importance of BESI's advanced packaging, anticipated to support upcoming generations of chips utilized in artificial intelligence (AI) and high-performance computing.

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Sophisticated packaging is presently a major constraint for the sector. BESI and Applied Materials have been partners for an extended period regarding hybrid bonding. The technology establishes connections between chips using copper-to-copper links, enabling quicker data transfer and reduced power usage in cutting-edge semiconductors.