Odisha Chief Minister Mohan Charan Majhi and Union IT Minister Ashwini Vaishnaw inaugurated the foundation for India’s initial advanced 3D chip packaging facility in Bhubaneswar, significantly enhancing India’s expanding semiconductor goals.

The initiative is being executed by 3D Glass Solutions Inc, a US company, via its fully owned Indian subsidiary, Heterogeneous Integration Packaging Solutions Pvt Ltd. It is supported by Intel, among others. Intel CEO Lip-Bu Tan participated in the ceremony online.

Majhi stated that the unit, which had its Rs 1,934 crore proposal sanctioned under the India Semiconductor Mission (ISM) last year, is anticipated to manufacture 70,000 glass panels each year, as well as 50 million assembled units. It is one of the two facilities in the state that obtained approval under the ISM, and approximately 13,000 advanced 3DHI modules, Majhi stated. The initiative will create approximately 2,500 direct and indirect employment opportunities.

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3D glass semiconductor technology is a sophisticated chip technique that employs unique glass substrates to facilitate high-performance, three-dimensional integration of electronic components. In contrast to conventional silicon, glass provides better radio frequency performance, reduced electrical loss, and improved thermal stability for integrating passive components. The facility will gather and wrap these chips.

Vaishnaw described the plant’s inauguration as a “historic” day for Odisha, noting that it represented a departure from the traditional industries the region has been known for. “It's crucial for Odisha to establish a world-class, advanced technology sector in this region.”

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Odisha is emerging as a center for IT and electronics manufacturing. Industries such as mining, metal, and power have been present in the state for years, but now it is moving towards the high-tech sector.

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This achievement enhances Odisha’s semiconductor ecosystem, positioning it as the first state in India to feature both a compound semiconductor manufacturing unit and a sophisticated 3D chip packaging facility utilizing Glass Substrates.