Taiwan Semiconductor Manufacturing Company (TSMC) claims that it is mass producing 3nm chips, which is believed to outperform the 5nm Chips used in the most recent Pro iPhone models, six months after Samsung reached 3nm production.

The company claims that within five years of volume manufacturing, 3nm technology will produce end goods with a market value of $1.5 trillion.

Additionally, the chip manufacturer is growing its 3nm capacity in Taiwan while simultaneously constructing a 3nm capacity at its facility in the US state of Arizona.

According to reports, Apple's upcoming M2 Pro SoC, which will power the upgraded MacBook Pro and Mac Mini models, will feature 3nm chips produced by TSMC.

But in 2024 the Arizona fab will start making 4nm chips, and in 2026 another fab will start making 3nm chips.

The chipmaker also disclosed that its international R&D center, which would house 8,000 R&D professionals, will open in Taiwan's Hsinchu Science Park in the second quarter of 2023.

Additionally, it is getting ready for its 2nm fabrication facilities, which is said to be situated in the Hsinchu and Central Taiwan Science Parks, with a total of six phases going according to schedule.

The company claims that its 3nm process, which is a complete node advance over the 5nm generation, is the most advanced semiconductor technology in terms of both power, performance, and area (PPA) and transistor technology.

In comparison to the 5nm (N5) process, its 3nm technology supports the ground-breaking TSMC FINFLEX architecture and provides gains in logic density of up to 1.6X and power savings of 30 percent to 35 percent at the same speed.